LTCC has the advantage that it can be sintered at lower temperatures than conventional ceramic substrates (e.g. alumina substrates). On the other hand, LTCC has advantages over printed circuit boards such as high heat resistance, the possibility of stacking and the ability to mount high frequency components inside the substrate. These properties have led to the development of products using LTCC in various fields.

In particular, the advantage of being stackable = more compact and thinner with the same functionality as printed circuit boards is in line with the market direction in recent years, and applications of LTCC as electronic components, substrates and modules are expanding more and more. As miniaturisation and high functionality are required in all fields, including automobiles, factories, electronic devices and infrastructure equipment, Yamamura Photonics’ LTCC has been used in the following fields, where it is highly valued for its high heat resistance and low dielectric loss, in addition to its ability to be mounted at high densities.

◆Automobile
Engine control unit called ECU
Sensor components that send air to the engine for combustion (air flow sensors)

◆Electronic equipment
Computer-related modules and packaged components
Interposer boards for semiconductor inspection

◆Infrastructure equipment
Infrastructure equipment – Substrates for Bluetooth, wireless LAN and millimetre wave technology.
High frequency module boards

More recently, as cars become more electrically powered and electric vehicles that run like precision machines become more common, the demand for ceramic substrates such as LTCC that are compact, thin and heat resistant is expected to increase further. To meet the needs of these cutting-edge fields, Yamamura Photonics is also developing products with even higher strength and lower loss than those currently available.