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Since higher output, smaller size, and higher integration were advancing, Efficient heat dissipation has become more important in the electronics field, such as power semiconductors, automobiles, high-brightness LEDs, 5G communications, and industrial equipment.
Yamamura Photonics has started to develop thermal conductive sheets using the original resin material named "hybrid resin", as the matrix resin. "Hybrid resin" is developed by the New Glass Company of Nihon Yamamura Glass, the parent company of Yamamura Photonics. "Hybrid resin material" has a high heat resistance of up to 250℃ and high electrical insulation due to fewer impurities. In addition, "hybrid resin" is easier to combine with filler compared to general resin materials. Taking advantage of these features, we are developing insulated thermal conductive sheets that achieve both reduced thermal resistance and space-saving by making them as thin as 100 μm or less.

Resin: PDMS hybrid material (manufactured by Nihon Yamamura Glass)
Filler: Boron nitride (BN), silicon nitride (SiN), aluminum nitride (AlN), other ceramic fillers
Thermal conductivity: 3.5-8.0W / (m・K)
Sheet size: Under consideration
Sheet thickness: 50-200 μm * New Glass Company can handle 200 μm or more
Various characteristics: coming soon

This product is under development and its specifications are subject to change without prior notice.
PDMS-based Hybrid Resin