PRODUCTS

With the increasing demand for miniaturized and low-profile modules in the electronic components market, as well as the rising need for lower dielectric loss in the telecommunications industry, Yamamura Photonics is actively developing High-Strength LTCC Substrate Green Sheets and Low-Dielectric-Loss LTCC Substrate Green Sheets.
The High-Strength LTCC Substrate Green Sheet is designed to achieve a flexural strength comparable to that of alumina substrates, making it suitable for high-performance, miniaturized, and low-profile electronic components and modules. While offering excellent mechanical strength, it can be co-fired at low temperatures, enabling the use of low-resistivity conductors such as Ag and Au, which are not compatible with HTCC (High-Temperature Co-fired Ceramics) substrates.
The Low-Dielectric-Loss LTCC Substrate Green Sheet is being developed to achieve ultra-low dielectric loss in the sub-6 GHz (3.5–6 GHz) and millimeter-wave (28 GHz and above) bands used in 5G communications. While LTCC substrates have traditionally been used in communication components and devices such as circuit boards and filters for signal processing, the demand for lower dielectric loss in high-frequency applications is growing, and we are actively developing materials optimized for such needs.

・High-Strength LTCC Green Sheet
Flexural Strength: Comparable to alumina substrates (>400 MPa)

・Low-Dielectric-Loss LTCC Substrate Green Sheet
Dielectric Loss: <0.04% (10 GHz)
Relative Permittivity (εr): 6

・Low-Permittivity, Low-Dielectric-Loss LTCC Substrate Green Sheet
Dielectric Loss: <0.13% (10 GHz)
Relative Permittivity (εr): 4

This product is under development and its specifications are subject to change without prior notice.

Sheet forming